Some questions about EOS S3 platform: packaging, LV variant, Sensor Processing Subsystem and documentation

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jon-fl
Posts: 4
Joined: Mon Mar 15, 2021 3:25 pm

Hello,

I am interested in using the EOS S3 multicore MCU in an open source battery operated hobby project (~1000 units) but have several questions:
  1. I understand from forum posts here that the QFN packaging is effectively end-of-life and that, as of last year, Quicklogic had been looking for a similarly user-friendly replacement package. Has Quicklogic made any headway in identifying one?
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  2. On Mouser I see several EOS S3 SKUs tagged with the part number suffix LV and the description text "low voltage," but I see no such distinction made in the ordering information in the datasheet and TRM. What is the difference between these parts? Are the LV parts binned to run at a lower voltage, and can these be sampled in QFN on a Quickfeather board for power evaluation?
    .
  3. Will the documentation and tooling for the Sensor Processing Subsystem be made available for open source projects? Even just an ISA description with encoding for the uDSP would be great for writing an open source assembler, and could be further extended later with an LLVM backend.
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  4. Typically FPGA parts from other manufacturers have more than just a basic datasheet and TRM. Will Quicklogic be making more information publicly available for the EOS S3, such as basic benchmark information for FPGA logic and I/O performance, and high-level user-visible details on the routing like the maximum number of unshared signals that can be used by the independent muxes in a logic block?
Thanks!

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Jon
anthony-ql
Posts: 49
Joined: Thu Jun 04, 2020 1:26 am

Will pass your request to marketing team.
jon-fl
Posts: 4
Joined: Mon Mar 15, 2021 3:25 pm

Thanks Anthony!
mwang
Posts: 10
Joined: Thu Jun 11, 2020 2:07 am

Hi Jon,

sent you a PM on this.

Regards
Mao
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